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7MSDP-B0-221X

Model :

1. MATERIL:
 INSULATOR: HIGH TEMPRATURE THERMOPLASTIC,UL94V-0,BLACK
    CONTACT: PHOSPHOR BRONZE

2. PLATING:
 CONTACT AREA: 10μ" Au PLATED OVER Ni
    SOLDER AREA: Tin PLATED OVER Ni

3. Decription:
 Push-Push Connector microSD(support NFC)

4. Applications:
 Smart Phone / PDA / MP3、MP4 / GPS / POS / Card Reader / Set-Top Box / DVR

 

   NFC MicroSD( Mobile Payment/Mobile Identity/Security Access Module/Cloud Security/KeyPro

)

 

 

 

Series:

 7MSDP-B0-2210 : location pillar
 7MSDP-B0-2211 : non location pillar

7MSDP-B0-221X